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边燕飞

作品数:2 被引量:2H指数:1
供职机构:哈尔滨工业大学更多>>
发文基金:国家自然科学基金更多>>
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铜与钌电化学机械抛光及其特性的研究
大规模集成电路制造中采用大马士革工艺实现多层铜互连结构,其中铜的电化学机械抛光与铜/钌阻挡层的电化学机械抛光是关键的两个独立的步骤。随着铜布线特征尺寸日益减小和器件结构层向微细复杂化发展,铜/低k介质材料互连技术为集成电...
边燕飞
关键词:铜元素材料去除率电偶腐蚀集成电路
5-methyl-1H-benzotriazole as potential corrosion inhibitor for electrochemical-mechanical planarization of copper被引量:1
2013年
According to the electrochemical analysis, the corrosion inhibition efficiency of 5-methyl-lH-benzotriazole (m-BTA) is higher than that of benzotrizaole (BTA). The inhibition capability of the m-BTA passive film formed in hydroxyethylidenediphosphonic acid (HEDP) electrolyte containing both m-BTA and chloride ions is superior to that formed in m-BTA-alone electrolyte, even at a high anodic potential. The results of electrical impedance spectroscopy, nano-scratch experiments and energy dispersive analysis of X-ray (EDAX) indicate that the enhancement of m-BTA inhibition capability may be due to the increasing thickness of passive film. Furthermore, X-ray photoelectron spectrometry (XPS) analysis indicates that the increase in passive film thickness can be attributed to the incorporation of C1 into the m-BTA passive film and the formation of [Cu(I)CI(rn-BTA)], polymer film on Cu surface. Therefore, the introduction of C1- into m-BTA-containing HEDP electrolyte is effective to enhance the passivation capability of m-BTA passive film, thus extending the operating potential window.
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