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陈立强

作品数:15 被引量:14H指数:2
供职机构:中国科学院微电子研究所更多>>
发文基金:国家自然科学基金国家重点基础研究发展计划更多>>
相关领域:电子电信更多>>

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15 条 记 录,以下是 1-10
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A Programmable 2.4GHz CMOS Multi-Modulus Frequency Divider被引量:1
2008年
A programmable multi-modulus frequency divider is designed and implemented in a 0. 35μm CMOS process. The multi-modulus frequency divider is a single chip with two dividers in series,which are divided by 4 or 5 prescaler and by 128-255 multi-modulus frequency divider. In the circuit design, power and speed trade-offs are analyzed for the prescaler, and power optimization techniques are used according to the input frequency of each divider cell for the 128-255 multimodulus frequency divider. The chip is designed with ESD protected I/O PAD. The dividers chain can work as high as 2.4GHz with a single ended input signal and beyond 2.6GHz with differential input signals. The dual-modulus prescaler consumes 11mA of current while the 128-255 multi-modulus frequency divider consumes 17mA of current with a 3.3V power supply. The core area of the die without PAD is 0.65mm × 0.3mm. This programmable multi-modulus frequency divider can be used for 2.4GHz ISM band PLL-based frequency synthesizers. To our knowledge, this is the first reported multi-modulus frequency divider with this structure in China.
李志强陈立强张健张海英
关键词:PRESCALERPROGRAMMABLE
4~8GHz GaAs HBT单片双平衡混频器
2008年
介绍了一种基于GaAs HBT的双平衡混频器。该混频器将射频、本振有源Balun集成其中,在RF和LO输入端分别采用不同的LC网络实现宽带的阻抗匹配。跨导级和开关单元之间采用交流耦合,并通过带宽扩展技术实现频带内的增益平坦。测量结果显示,该混频器匹配良好,射频端口S11在3~10GHz频带内小于-10dB。在固定中频200MHz情况下测试,在4~8GHz射频频带内,平均增益10dB,波动小于1dB,中频输出端口对射频信号的隔离度优于25dB,对本振信号的隔离度优于28dB;本振-射频端口隔离度优于32dB。在3.3V直流电压下测得的功耗为66mW。
张健张海英陈立强李志强陈普峰
关键词:GAASHBT混频器带宽扩展
C波段宽带GaAs HBT单片双平衡混频器
介绍了一种基于GaAs HBT的双平衡混频器。该混频器将射频、本振有源Balun集成其中,在RF和LO输入端分别采用不同的LC网络实现宽带的阻抗匹配。跨导级和开关单元之间采用交流耦合,并通过带宽扩展技术实现频带内的增益平...
张健张海英陈立强李志强陈普峰
关键词:混频器阻抗匹配
一种高增益平坦度MMIC功放单片的调试方法被引量:2
2007年
通过对自主流片的MMIC功率放大器单片的调试,总结出了一套行之有效的MMIC的调试方法.试验结果表明这种将电路仿真和实际测试相结合的方法,有效地减小由于模型和工艺误差带来的电路性能的降低,对于以后MMIC电路特别是功放的电路的调试工作起到了一定指导作用.
朱旻梁晓新陈立强郝明丽张海英刘训春
关键词:功放HBTMMIC
InP基PHEMT欧姆接触低温合金化工艺的研究被引量:1
2005年
对InP基PHEMT的源漏欧姆接触低温合金化工艺进行了研究,与常规的合金工艺不同,通过在低温下进行合金化,并采用金属面倒置和快速热退火的办法,制成了比接触电阻为1.26×10-3Ω·cm2 形貌良好的欧姆接触。避免了PHEMT各层化合物半导体之间的相互作用和分解,以及能带结构变化引起的二维电子气退化,也大大减弱了高温带来的肖特基势垒层中的杂质元素往沟道内扩散引起二维电子气迁移率下降的问题。
李潇张海英李海鸥尹军舰刘亮陈立强
关键词:磷化铟低温合金欧姆接触
A Monolithic InGaP/GaAs HBT PA for TD-SCDMA Handset Application被引量:1
2008年
This paper demonstrates the design and fabrication of a monolithic HBT power amplifier for TD-SCDMA cellu- lar phones that achieves high efficiency and linearity. The two-stage MMIC integrates the input matching circuits,interstage matching circuits, and active bias circuits in a single chip with size as small as 0.91mm × 0.98mm. The amplifier obtains a power-added efficiency of 43% (15%) and a gain of 28.5dB (24dB) at the high and low operation mode under the 3.4V supply. In addition, the adjacent channel leakage power is below - 45dBc/- 56dBc and - 39dBc/- 50dBc at 1.6MHz/3.2MHz offset in low and high power output modes, respectively, with QPSK modulation. The MMIC offers the potential for low cost production due to small chip size, stable voltage supply, and high performance at the same time.
毕晓君张海英陈立强黄清华
关键词:PAEACPR
A Monolithic InGaP/GaAs HBT VCO for 5GHz Wireless Applications被引量:1
2007年
A monolithic voltage controlled oscillator (VCO) based on negative resistance principle is presented uti-lizing commercially available InGaP/GaAs hetero-junction bipolar transistor (HBT) technology. This VCO is de-signed for 5GHz-band wireless applications. Except for bypass and decoupled capacitors,no external component is needed for real application. Its measured output frequency range is from 4.17 to 4.56GHz,which is very close to the simulation one. And the phase noise at an offset frequency of 1MHz is -112dBc/Hz. The VCO core dissipates 15.5mW from a 3.3V supply,and the output power ranges from 0 to 2dBm. To compare with other oscillators,the figure of merit is calculated,which is about -173.2dBc/Hz. Meanwhile, the principle and design method of nega-tive resistance oscillator are also discussed.
陈立强张健李志强陈普锋张海英
关键词:VCOMMIC
Ka波段单片低噪声放大器被引量:4
2007年
利用0.25μm GaAs PHEMT工艺设计并制作了一种Ka波段低噪声放大器芯片.提出了适用于低噪声放大器的PHEMT器件特征.电路采用四级级联结构.利用微带电路实现输入、输出和级间匹配.通过对电路增益、噪声系数和驻波比等指标进行多目标优化,确定了器件参数.该放大器测试结果为:26.5-36 GHz频段内增益大于20 dB;多数测试点噪声系数小于3 dB,其中34 GHz频点噪声仅为1.94 dB;芯片面积2.88 mm×1 mm.
杨浩黄华郝明丽陈立强张海英
关键词:微波单片集成电路低噪声放大器赝配高电子迁移率晶体管微带电路
Lattice-Matched InP-Based HEMTs with T^T of 120GHz 被引量:2
2005年
Lattice matched InP based InAlAs/InGaAs HEMTs with 120GHz cutoff frequency are reported.These devices demonstrate excellent DC characteristics:the extrinsic transconductance of 600mS/mm,the threshold voltage of -1 2V,and the maximum current density of 500mA/mm.
陈立强张海英尹军舰钱鹤牛洁斌
关键词:INALAS/INGAASINP
双层InGaAs沟道InP HEMT
2006年
阐述了一种新型的In0.80Ga0.20As/In0.53Ga0.47As双沟道InPHEMT结构。采用这种双沟道结构能够有效地提高沟道中电子的迁移率,减小碰撞电离对HEMT性能的影响;从而既显著提高了HEMT的截止频率,又可获得很高的直流输出电流。0.35μm栅长HEMT器件的电流增益截止频率达到120GHz,饱和电流密度、跨导达到790mA/mm、1050mS/mm,栅极击穿电压和通态击穿电压分别为5V和3.2V。
尹军舰陈立强汪宁张海英刘训春牛洁斌
关键词:HEMT迁移率
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