A novel Fudan programmable logic chip （FDP） was designed and implemented with a SMIC 0. 18μm CMOS logic process. The new 3-LUT based logic cell circuit increases logic density about 11% compared with a traditional 4-input LUT. The unique hierarchy routing fabrics and effective switch box optimize the routing wire segments and make it possible for different lengths to connect directly. The FDP contains 1,600 programmable logic cells, 160 programmable I/O, and 16kbit dual port block RAM. Its die size is 6. 104mm× 6. 620mm, with the package of QFP208. The hardware and software cooperation tests indicate that FDP chip works correctly and efficiently.
