The microstructure and microhardness of Sn-3.5%Ag solders were explored in the cooling rate ranging from 0.08 to 104 K/s. Under rapid cooling condition, the strong kinetic undercooling effect leads to the actual solidification process starting at the temperature lower than the equilibrium eutectic point, and the actual metastable eutectic point shifts to the higher Ag concentration. Hence, the higher the applied cooling rate is, the more the volume fraction of primary β-Sn crystal forms. At the same time, the separation of primary β-Sn crystal favors restraining the formation of bulk Ag3Sn intermetallic compounds (IMCs) in solder due to the mismatch crystalline orientation relationship, those Ag3Sn phase separating through the eutectic reaction could hardly cling to the primary β-Sn crystal and grow up. Additionally, the Vickers hardness test shows that fine β-Sn and spherical Ag3Sn phase in the rapidly solidified alloy strongly improves the microhardness of the Sn-3.5%Ag solder.
The influences of thermal stabilization of austenitic on the onset temperature for a martensite transformation in T91 ferritic heat-resistant steel were studied by high-resolution differential dilatometer. The phase transformation kinetic information was obtained by adopting lever rule from the recorded dilatometric curves. The results show that an inverse stabilization, featured by the damage of ＂the atmosphere of carbon atoms＂ and the increase of the starting temperature for martensite transformation takes place when the T91 ferritic steel is isothermally treated above the Ms point, and it becomes strong with increasing the holding time. While the continued temperature for martensite transformation decreases gradually when isothermally holding at a temperature below Ms point. The observed inverse stabilization behavior could be attributed to the relatively high temperature of Ms point in the explored T91 ferritic heat-resistant steel.
Baoqun NINGYongchang LIUQingzhi SHIZhiming GAOLiushuan YANG
